| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and a semiconductor manufacturing method capable of precisely detecting an etching end point of a cycle etching.SOLUTION: The semiconductor manufacturing device has an extraction section that extracts the light emission intensity in the first step in each cycle in cycle etching in which a first step to etch a layer to be etched and a second step to performing a processing different from the first step are repeated plural cycles. The device also has a detection section that detect an etching end point on the layer to be etched in the cycle etching based on the light emission intensity for the plural cycles.SELECTED DRAWING: Figure 1 |
