| 摘要 |
<p>A method for fabricating a wood-chip board equipped with at least one decorative layer provided with relief-like formed portions which comprises the steps of forming pre-compressed chip stock composed of at least a coarse chip layer and a fine chip layer. A deformable decorative layer is placed on top of the fine chip layer. A relief carrier provided with relief-like protuberances is inserted between the decorative layer and a substantially flat press member placed over such decorative layer. Then, during the same working operation the chip stock and the decorative layer are pressed and glued together and a relief-like pattern is formed at the decorative layer and at least at the neighboring portions of the fine chip layer.</p> |
