METHOD OF MANUFACTURING CERAMIC CIRCUIT BOARD

摘要

PURPOSE:To provide the title manufacturing method of ceramic circuit board having excellent thermal shock resistance and capable of preventing the disconnection of a surface layer conductor. CONSTITUTION:In order to manufacture the title ceramic circuit board having a grazed film 2 on the surface of a ceramic board, the grazed film 2 is formed on the surface of a ceramic green sheet 100 and then a molded body 19 comprising the ceramic green sheet 100 and the grazed film 2 is siumultaneously baked. Besides, it is preferable that the surface of the molded body 19 is pressed with a parallel flat plate 6 before the molded body 19 is baked. At this time, as the ceramic green sheet 100, a low temperature sintered board sintered at the temperature not exceeding 1000 deg.C can be used.