| 摘要 |
<p>PURPOSE:To contrive the prevention of damage by dividing a high heat conductive member into a plurality of pieces. CONSTITUTION:Heat generated in a semiconductor element 1 is transmitted to a hight heat conductive member 6 via a resin 5 on the upper part of the element 1 and can be dissipated efficiently in the air. As the member 6 is divided into a plurality of pieces, a high thermal stress is never generated in the interior, which is molded with the resin 5, of a semiconductor device and damage, such as cracks in the element 1 and the resin 5, peeling of the adhesive interfaces among individual members and the like, can be prevented. Moreover, as the result of a reduction in the thermal stress, the thickness of the resin 5 can be made small. Therefore, the height of the whole of this semiconductor device can be made small and it also becomes possible to contrive the improvement of a mounting density.</p> |
