发明名称 WARM-WALL TYPE REACTION CHAMBER PART AND FORMATION OF A HEMI-SPHERICAL GRAIN FILM USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a warm-wall type reaction chamber part and also to provide a method for forming a hemi-spherical grain film using the same. SOLUTION: The chamber part includes a reaction chamber 41, a heat insulating means 52 provided to surround the chamber 41, and a susceptor 40 provided so that a semiconductor substrate 44 is placed within the chamber 41. The heat insulating means 52 for being able to prevent heat radiation from the chamber 41 while keeping the temperature within the chamber in a range of about 200 to 500 deg.C is provided to selectively form a hemi-spherical grain(HSG) film on a storage electrode. A step time necessary from formation of an HSG silicone nuclei to formation of the HSG silicone film can be remarkably reduced. Thereby a semiconductor device having the HSFG silicone film can be improved in its productivity.</p>
申请公布号 JPH10163432(A) 申请公布日期 1998.06.19
申请号 JP19970330560 申请日期 1997.12.01
申请人 SAMSUNG ELECTRON CO LTD 发明人 SHIM SE-JIN;JIN YOU-CHAN;NAM SEUNG-HEE;KANG SEUNG-DONG
分类号 H01L27/04;C23C16/24;C23C16/46;H01L21/02;H01L21/20;H01L21/205;H01L21/822;H01L27/108;(IPC1-7):H01L27/04 主分类号 H01L27/04
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