SEMICONDUCTOR CHIP AND METHOD OF SEPARATING A COMPOSITE INTO SEMICONDUCTOR CHIPS

摘要

The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape. The invention also concerns a method of separating a composite into a plurality of semiconductor chips (100) along a separation pattern (15) with the steps enabling a plurality of semiconductor chips according to the invention to be produced.

主权项

1. A semiconductor chip having a semiconductor body, which comprises a semiconductor layer sequence, having a carrier body and having at least one top side contact, wherein the semiconductor chip has in projection a shape that deviates from a rectangular shape.