| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a lead frame which enhances positioning accuracy of a chip element to a circuit substrate, a package type electronic component and an electronic apparatus. <P>SOLUTION: The lead frame 4 includes a die pad 4c wherein a chip element 30 is mounted and leads 4 that are connected with electrodes 30a of the chip element 30 through a bonding wire 5, and an inner lead 40d of the lead 4d and the die pad 4c are sealed together with the chip element 30 by a package 31. The lead frame 4 also includes first recognition reference parts 40e and 40e and second recognition parts 40f and 40f as recognition reference that are exposed over the outside of the package 31 and position the chip element 30 at the die pad 4c. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
