| 摘要 |
Semiconductor device includes a pair of substrates ( 1, 2 ) disposed oppositely, semiconductor elements ( 5, 6 ) formed in the substrates ( 1, 2 ), respectively, and having semiconductor circuits ( 3, 4 ) and electrodes ( 7, 8 ), respectively, a wiring conductor ( 9 ) interposed between the electrodes ( 7, 8 ), and a through electrode ( 12 ) extending through one substrate ( 1 ) and connected to the electrode ( 7 ) via the wiring conductor ( 9 ). The other substrate ( 2 ) is disposed laterally of the through electrode ( 12 ). Surface of the through electrode ( 12 ) projecting from the one substrate ( 1 ) and lateral surface of the element ( 6 ) are coated with an insulation material ( 13 ). The through electrode ( 12 ) has one end exposed in a back surface of the one substrate ( 1 ), while other end is positioned flush with a back surface of the other substrate ( 2 ), being exposed. |
