发明名称 BONDING APPARATUS
摘要 PURPOSE:To make it possible to position a lead frame without using a positioning pin, by providing a control part, which corrects the amount of conveying the lead frame by a conveying mechanism in correspondence with the amounts of positions that are detected by a detector. CONSTITUTION:A lead frame 2 is sent on a conveying path. At first a conveying motor 36 is operated so that the frame is conveyed to a semiconductor chip 18 at the first position in the conveying direction by a distance (e) with a tip S as a leading part. At this time, the first semiconductor chip 18 is positioned with a lower roller 33 and the lead frame 2, which is slipperly and has errors in size and the like. The amounts of deviation in positioning at this time Cs, Cy, Dx and Dy are detected by an ITV camera 23. Based on the detected signals, an X motor 20a and a Y motor 20b are controlled. The position of a bonding head 16 is corrected in a correspondence with the amounts of deviation Cx, Cy, Dx and Dy, and bonding is performed. Based on the amounts of position deviation, the conveying amount of the lead frame 2 is controlled. Therefore, a positioning pins is not required, and the structure is not complicated.
申请公布号 JPS62193135(A) 申请公布日期 1987.08.25
申请号 JP19860034702 申请日期 1986.02.19
申请人 TOSHIBA CORP 发明人 KASHIMA NORIYASU;ATSUMI KOICHIRO;OKANO KEITARO;IKETANI YUKIHIRO
分类号 H01L21/50;H01L21/60 主分类号 H01L21/50
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