发明名称 MOLDING METHOD AND MOLDING TOOL THEREOF
摘要 PURPOSE:To omit deburring work of side flash after resin molding, by forming a resin lump, which has excellent separating property from a molded body on the side of the end surface of a molded material on the side where the resin is injected. CONSTITUTION:When a lead frame 1 and hardened resin 3 are removed from a bottom force 7 of a mold, the lead frame 1 and the entire hardened body of the resin are removed as a unitary body. When a molding body 12, which covers the upper and lower surfaces of the lead frame 1, and the resin lump, which remains in a resin injecting path 5 and is hardened, are separated at an interface and removed, the entire hardened resin lump remaining in the resin transporting path 4 is removed together. At this time, since on end surface of the lead frame 1 on th side of the resin injecting path 5 is protruded in the resin transporting path 4, a space, in which side flash 2 is yielded, is not present on the one end surface side of the lead frame. Thus, deburring work of the side flash is not required. The yield of indentations in the surface of the leads due to resin bodies formed with fallen side flash can be prevented. Decrease in availabilities of various apparatus can also be prevented.
申请公布号 JPS62193132(A) 申请公布日期 1987.08.25
申请号 JP19860032946 申请日期 1986.02.19
申请人 HITACHI LTD 发明人 SAKAMOTO TOMOO;NAKAGAWA TAKASHI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29L31/34 主分类号 H01L21/56
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