| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer support device capable of preventing damage to the rear of a wafer and a wafer from deviation in position, when the wafer is lifted up and keeping at least its wafer support area having a uniform temperature distribution. SOLUTION: A wafer support device is equipped with a wafer support body 22 possessed of heat sources each located at its upper and lower part respectively and disposed in a processing chamber provided in a semiconductor manufacturing device, a lift piece 36 with a sloping top surface extending inwardly from outside a support area 26 located on the top surface of the body 22, an arc- shaped lift ring 32 supporting the lift piece 36, and a lift pin 48 whose upper edge is connected to the lift ring 32 and which is moved up and down through a through-hole 46 bored in the wafer support body 22, and the through-hole 46 substantially is stopped up with the lift ring 32 when the lift pin 48 is made to descend. With such a setup, irregularity in the temperature distribution due to the through-hole can be eliminated.
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