发明名称 DEVELOPMENT DEFECT PREVENTING PROCESS AND MATERIAL
摘要 <p>For example, a development defect reducing composite made of an acidic composite containing a surface-active agent is applied to a chemically amplified photoresist film formed on a substrate of 8 inches or more. As a result, the resist surface is made hydrophilic, and a hardly soluble layer with respect to a developing liquid is prevented from being formed on the resist surface. By the acid diffusion of a proper amount from the developing defect reducing composite, moreover, the reduction in the film thickness of the chemically amplified photoresist after exposed and developed is greater by 10 angstroms to 500 angstroms than that of when the development defect reducing composite is not applied, a resist pattern such as a T-top or a round top having no degradation in the pattern shape is formed.</p>
申请公布号 WO2002001299(P1) 申请公布日期 2002.01.03
申请号 JP2001005072 申请日期 2001.06.14
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