TAPE CARRIER FOR SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device, which prevents excessive precipitation of tin on a lead side surface and is plated with a highly reliable electroless tin plating. SOLUTION: A copper plating layer 4 is formed on a conductive pattern of a copper foil 3 coated on a polyimide resin film 1 via a nickel sputter layer 2 and the electroless tin plating layer 5 is formed on the copper layer 4.