| 摘要 |
PROBLEM TO BE SOLVED: To provide a substitution gold plating bath giving satisfactory solder joinability to a gold plating film to be formed, and to provide a substitution gold plating method using the same. SOLUTION: The substitution type gold plating bath contains: (A) one or more kinds selected from amino acids, amino acid salts, primary amine compounds, secondary amine compounds and tertiary amine compounds; (B) one or more kinds selected from ethylenediaminetetraacetic acids, diethylenetriaminepentaacetic acids, triethylenetetraminehexaacetic acids and their salts; (C) one or more kinds selected from sulfurous acids and the salts thereof; and (D) a gold cyanide salt. In the substitution gold plating method, a substrate layer is formed on the object to be plated, and next, the substrate layer is subjected to gold plating using the substitution type gold plating bath. COPYRIGHT: (C)2005,JPO&NCIPI
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