| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent mold release properties and excellent package appearance and an electronic component apparatus equipped with an element sealed with an epoxy resin composition. SOLUTION: The epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) a release agent being an oxidized polyolefin-based wax compound produced by using a metallocene-based catalyst and (F) a compound containing one or more kinds of copolymers between anα-olefin and at least one of maleic anhydride and a maleic anhydride derivative, as essential components. The electronic component apparatus is equipped with an element sealed using the epoxy resin composition. COPYRIGHT: (C)2010,JPO&INPIT
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