发明名称 SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and a method of manufacturing a semiconductor device that enable a low-cost, high-quality film formation process with respect to a method of molding an effective shield layer and efficient molding of the shield layer.SOLUTION: A mold device 100a has: a supply part 101 that accommodates and supplies a work-piece; processing parts 102 and 105 that perform a process of forming a function layer on the work-piece supplied from the supply part by application; press parts 103 and 104 that perform resin molding; and a housing part 106 that houses the work-piece subjected to the process of forming the function layer.SELECTED DRAWING: Figure 1
申请公布号 JP2016115722(A) 申请公布日期 2016.06.23
申请号 JP20140251147 申请日期 2014.12.11
申请人 APIC YAMADA CORP 发明人 KIDA KENJI;SATO HISASHI
分类号 H01L21/56;H01L23/00;H01L23/28 主分类号 H01L21/56
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