发明名称 |
SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device and a method of manufacturing a semiconductor device that enable a low-cost, high-quality film formation process with respect to a method of molding an effective shield layer and efficient molding of the shield layer.SOLUTION: A mold device 100a has: a supply part 101 that accommodates and supplies a work-piece; processing parts 102 and 105 that perform a process of forming a function layer on the work-piece supplied from the supply part by application; press parts 103 and 104 that perform resin molding; and a housing part 106 that houses the work-piece subjected to the process of forming the function layer.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016115722(A) |
申请公布日期 |
2016.06.23 |
申请号 |
JP20140251147 |
申请日期 |
2014.12.11 |
申请人 |
APIC YAMADA CORP |
发明人 |
KIDA KENJI;SATO HISASHI |
分类号 |
H01L21/56;H01L23/00;H01L23/28 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|