| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition having excellent thermal conductivity, slight warpage and flash of a molded product, i.e., excellent molding processability. <P>SOLUTION: This thermoplastic resin composition has ≥0.5 W/mK thermal conductivity and linear expansion coefficient anisotropy within the range of 1.0-2.5. <P>COPYRIGHT: (C)2003,JPO |
