| 摘要 |
A transistor, wherein a semiconductor wafer is soldered to a metallic base and has one or two exposed contacts which are connected to pin-shaped terminals of the base by U-shaped elastic leads having coiled first end portions, straight intermediate portions and straight second end portions, is assembled by deforming the leads to tilt the coiled end portions with reference to the terminals and to thereby clamp such coiled end portions to the terminals in positions in which the end faces of the second end portions are in full surface-to-surface abutment with layers of solder which coat the contacts on the wafer, or by causing the second end portions to bear against the respective contacts merely by the action of gravity. The thus assembled working parts of the transistor are thereupon heated in a soldering furnace to bond the wafer to the base and to simultaneously solder the second end portions of the leads to the respective contacts. The coiled end portions are bonded to the respective terminals in response to melting of rings of soft solder which are slipped onto the terminals prior to heating so as to rest on the respective coiled end portions. |
