| 摘要 |
1458846 Semi-conductor devices RAYTHEON CO 4 Nov 1974 [3 Dec 1973] 47638/74 Heading H1K End portions 18 of the fingers of a lead frame to which beam leads 14 of semi-conductor chip device 18 are to be electrically connected are of reduced thickness compared with the rest of the lead frame. The tendency to twisting or lateral movement of the fingers under the bonding pressure is reduced, particularly if the ends are thinner than their width. As shown, the frame leads 16 are bonded to ceramic base 20 by glass layer 24, and encapsulation is completed by bonding ceramic cover 26 to the frame leads by glass layers 32. Preferably the co-efficients of thermal expansion of the various bonded parts substantially metal. |
