| 摘要 |
A socket (2) for a ball grid array (BGA) integrated circuit package (4) comprises an array of electrical contacts extending through openings in a slidable plate (10). The contacts are cupped or angled to mate with the side and top of the ball leads of the BGA. The BGA package (4) is inserted into the socket (2) without any interfering structure, and there may be guide surfaces to align the ball leads with the openings. Actuating a manually rotatable cam in one direction by an arm (6) drives the slidable plate (10) parallel to the plane of the ball leads to widen the opening to allow entry of the balls into the plate (10). Driving the plate (10) in the opposite direction reduces the openings. When the plate openings are reduced with the ball leads within the openings, electrical conductivity is provided between the ball lead and the socket electrical contact. Ends of the bifurcated contacts have sharp edges that penetrate any oxidation on the ball leads to provide gas free connections.
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