COMPOSITE COPPER FOIL, MANUFACTURE THEREOF, COPPER-PLATED LAMINATE AND PRINTED WIRING BOARD PROVIDED THEREWITH

摘要

PROBLEM TO BE SOLVED: To enable a composite copper foil to be kept excellent in characteristics as a release layer even if the composite copper foil is subjected to a high temperature when a printed wiring board is manufactured by a method wherein the composite copper foil is equipped with an organic release layer interposed between a support metal layer and a very thin copper foil. SOLUTION: A printed wiring board is composed of a board 6 and a printed wiring pattern formed on the board 6. A support metal 2 is peeled off to expose the very thin copper foil 4 of a copper-plated board, a residual release layer 3 is removed if necessary, and a wiring pattern is formed on the exposed very thin copper foil 4 to form the printed wiring board. A composite copper foil is laminated on the one side of an inner board where a wiring pattern is previously formed to form a copper-plated laminated board, the support metal layer is removed to expose the very thin copper foil, and a wiring pattern is formed to manufacture a multilayer printed wiring board. By this setup, a support is uniform and proper in peeling strength, and a very thin copper foil excellent in handling properties and release properties can be obtained.