| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent the generation of solder fillets due to the creeping-up of a molten soldering material along a lead terminal, in a chip type solid-state electrolytic capacitor with a pair of lead terminals bent like crab legs. SOLUTION: In the chip type solid-state electrolytic capacitor 10, a resin packaging material 4 is formed around a capacitor element 2 formed of a sintered material of valve action metal powder. The pair of lead terminals 3 and 3 are extracted from the right and left sides of the resin packaging material 4, and then are bent like crab legs along the side face and bottom face of the resin packaging material 4. Side plates 3a and 3a of the lead terminals 3 and 3 disposed along the side face of the resin packaging material 4 are formed with solder non-attached surfaces 11 and 11 created by removing solder plating from parts of the lead terminals 3 and 3.
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