发明名称 Housing for an optoelectronic device emitting electromagnetic radiation, device and method for manufacturing said housing or device
摘要 The housing (2) has a body (25) comprising a recess (50), in which a chip mounting surface is arranged, where the body is made from plastic or a ceramic material. An outer surface (24) of the body is arranged on a radiating side of the housing and provided with a shielding layer (3) that is provided for shielding an electromagnetic radiation, where the layer is made from plastic. The outer surface has an area running perpendicular to an optical axis of the housing and/or parallel to the chip mounting surface. An independent claim is also included for a method for manufacturing a housing for an optoelectronic component.
申请公布号 EP1770793(A3) 申请公布日期 2007.12.12
申请号 EP20060018039 申请日期 2006.08.29
申请人 OSRAM OPTO SEMICONDUCTORS GMBH;HELLA KGAA HUECK & CO. 发明人 SCHWENKSCHUSTER, LUKAS;WUELLER, MARTIN;REILL, JOACHIM;ENGL, MORITZ
分类号 F21K99/00;F21S8/10;H01L33/44;H01L33/48;H01L33/60 主分类号 F21K99/00
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