BUILDUP WIRING BOARD, AND ITS MANUFACTURING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable buildup wiring board in which the diameter at the bottom of a via formed in a buildup layer can be made substantially uniform. SOLUTION: In the buildup wiring board comprising a core substrate 11 having a via 12 formed in the insulating layer and filled with conductive paste 13 for interlayer connection, and a buildup layer 14 formed at least on one side of the core substrate 11 and having a via 15 for interlayer connection, the diameter at the bottom of the via 15 formed in the buildup layer 14 is made substantially uniform. COPYRIGHT: (C)2008,JPO&INPIT