发明名称 |
Method for manufacturing a leadframe, packaging method for using the leadframe and semiconductor package product |
摘要 |
A leadframe package includes a die pad with four unitary, outwardly extending slender bars; a plurality of leads arranged along periphery of the die pad; a separate pad segment separated from the die pad and isolated from the plurality of leads; a semiconductor die mounted on an upper side of the die pad, wherein the semiconductor die contains first bond pads wire-bonded to respective the plurality of leads and a second bond pad wire-bonded to the separate pad segment; and a molding compound encapsulating the semiconductor die, the upper side of the die pad, the first suspended pad segment and inner portions of the plurality of leads. |
申请公布号 |
EP1944802(A2) |
申请公布日期 |
2008.07.16 |
申请号 |
EP20070025144 |
申请日期 |
2007.12.27 |
申请人 |
MEDIATEK, INC |
发明人 |
CHEN, NAN-JANG;LIN, HONG-CHIN |
分类号 |
H01L23/495;H01L21/48;H01L23/31;H01L23/50;H01L25/065 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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