| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the subject sheet which can prevent the occurrence of chippings at the time of dicing a semiconductor wafer. SOLUTION: A sheet for fixing a semiconductor wafer which comprises a base material in a sheet form and a pressure-sensitive adhesive layer laminated on the base material, wherein a chipping preventive layer is laminated between the base material and the pressure-sensitive adhesive layer. The chipping preventive layer comprises 100 pts.wt. of a base polymer, 10-200 pts.wt. of a heat-polymerizable compound, and 0.1-10 pts.wt. of a heat-polymerization initiator, and has a modulus of 5.0×105-1.0×1011 dyn/cm2 and a thickness of 5-25μm.</p> |
