| 摘要 |
PROBLEM TO BE SOLVED: To decrease the man-hours for works, shorten the construction term, and suppress the manufacturing costs for a wafer polishing head by performing the retainer ring polishing works effectively. SOLUTION: A wafer polishing head H is equipped with a head body 1 consisting of a top plate 1a and circumferential wall 1b, a diaphragm 2 installed stretching inside the head body 1, a carrier 3 to displace a wafer W in association with deformation of the diaphragm 2, a retaier ring 4 abutting to the udersurface of the diaphragm 2 and arranged displaceably in compliance with the deformation of the diaphragm, and a pressure adjusting mechanism 5 to deform the diaphragm 2 in the head axial direction L, wherein the retainer ring 4 is held independently of the head body 1, diaphragm 2 and carrier 3 and in such a way as separable from the diaphragm 2. Accordigly strain generation is unlikely in the retainer ring 4 even after installation on the polishing head H, and polishing works for the retainer ring 4 after installation are no more needed. |
