发明名称 スパッタリング装置および基板処理装置
摘要 A sputtering apparatus includes a shutter unit, a plurality of target holders, and a substrate holder which can rotate about an axis perpendicular to a surface on which a substrate is held. The shutter unit includes a first shutter having first and second apertures and a second shutter having third and fourth apertures. The plurality of target holders are arranged on a first virtual circle centered on the axis, with the arrangement intervals between the plurality of target holders on the first virtual circle including at least two types of arrangement intervals.
申请公布号 JP5922795(B2) 申请公布日期 2016.05.24
申请号 JP20140549760 申请日期 2013.08.23
申请人 キヤノンアネルバ株式会社 发明人 石原 繁紀;戸谷 寛行;安松 保志;中澤 俊和;中村 英司;須田 真太郎;今井 慎;藤本 雄
分类号 C23C14/34 主分类号 C23C14/34
代理机构 代理人
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