| 摘要 |
PURPOSE:To improve the rate of yield in a bonding process by a method wherein a wire accommodated in a capillary is gripped at its middle point by an upper clamp, when an upper clamp and a lower clamp, and a wire-accommodating capillary travelling up and down are employed in a bonding process. CONSTITUTION:After bonding of an Au ball 12 to a pellet 1 at a position 13, the capillary 10 goes up, and then comes down again. When the Au wire 3 is bonded to a lead frame 2, an upper clamp grips the Au wire 3. This keeps the Au wire 3 positioned under the capillary 10 from an excessive slack, thereby improving the rate of yield in a bonding process. |
