摘要 |
PURPOSE:To remove a DHD type diode having the defect of a contacting system due to an Ag bump shape by measuring electric characteristics after stress application by cooling the DHD diode externally while making the diode generate heat internally. CONSTITUTION:A sample 3 is supplied with electric power from a DC power source 1 and cooled by a cooling spray when generating heat internally. This quenching is performed once or plural times within a predetermined internal heat generation time. The electric characteristics are inspected a feeding time later. In this inspection, the sample 3 is heated by a dryer 5 while the waveform is observed by a curve tracer 4 equipped with a waveform monitor and a power source, thereby inspecting variation of the waveform.
|