LEAD FRAME FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

PURPOSE:To provide a lead frame capable of avoiding the solder plating deformation due to the clamping in molding step and the resultant occurrence of solder whisker during lead cutting and bending steps. CONSTITUTION:A lead frame member 11 is coated with a tin plating layer 30 and a solder plating layer 20 further on the layer 30. At this time, the solderplating layer 20 will be on the topmost surface of the outer lead. On the other hand, the solder plating layer 20 includes a tin layer 21 and a lead layer 22.