| 摘要 |
PROBLEM TO BE SOLVED: To provide a method suited for manufacturing an electronic component manufacturing base using a ring structure-containing hardening resin, and a cleaning solvent suited for cleaning the ring structure-containing hardening resin. SOLUTION: The method of manufacturing a base for manufacturing electronic components comprises a step of applying on the base a hardening resin solution of a ring structure-containing hardening resin dissolved or dispersed in an organic solvent, a step of processing and removing unwanted hardening resin solution deposited to at least a part of the periphery, edges and backside of the base using a cleaning solvent composed of a nonpolar solvent and a polar solvent, and a step of drying the applied hardening resin on the base and a cleaning solvent suited thereto.
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