| 摘要 |
PROBLEM TO BE SOLVED: To deal with an automation by facilitating a treatment of an end material to recover a wafer after an ingot is cut by a wire saw, and to facilitate a recovery of the wafer at each lot after a plurality of ingots are simultaneously mounted at a slice base and cut. SOLUTION: A method for recovering the wafer comprises the steps of coating end faces of a plurality of the ingots, for example, with an ink by a coating means, mounting the ingots in series at the wire saw to cut the ingots, thereby obtaining many wafer groups, and thereafter sheeting the wafers. The method further comprises the steps of belt conveying the wafers one by one, monitoring surfaces of the wafers by an imaging means, and processing the image to decide the presence or absence of an identification mark. The method also comprises the steps of discarding the wafer (end material) decided to have the mark in a basket, incorporating the other wafers in a cassette, replacing the cassette at timing of sensing the end material, and partitioning the wafers at each lot.
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