| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mirror chamfering device and a polishing cloth therefor which are capable of improving the uniformity of mirror chamfering across the whole outer periphery of a wafer, and preventing the peeling of the polishing cloth from a rotary drum during mirror chamfering while reducing the recovery frequency of the polishing cloth. <P>SOLUTION: The polishing cloth 14 is employed with a parallelogram configuration and whose length in the winding direction around the rotary drum 13 is shorter than the outer peripheral length of the rotary drum 13 by 1-2 mm. Highly accurate and highly uniform condition can be maintained in the mirror chamfering across the whole of outer periphery of the silicon wafer W. According to this method, invasion of polishing liquid into the outer periphery of the wafer upon polishing can be suppressed. Further, peeling of the polishing cloth 14 from the rotary drum 13 becomes hard during the mirror chamfering, and the running cost of the mirror chamfering device 10 can be reduced whereby the productivity of the silicon wafer W can be improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
