| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent reliability, yield, and derivation efficiency of light from being deteriorated by enabling fixation of cut debris of an element sealing resin layer to be severely restrained. <P>SOLUTION: A method comprises a first process wherein there is made hydrophylic the entire surface on a substrate 1 on the top surface of which an LED chip 2 is mounted, and which is sealed with a resin layer 3; and a second process wherein the resin layer and the substrate are cut by a dicing blade, at a position where an LED chip is avoided while flowing cleaning water on the surface of the resin layer and on the substrate after the substrate is made hydrophilic. <P>COPYRIGHT: (C)2007,JPO&INPIT |
