发明名称 BONDING DEVICE, AND TEACHING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding device and a teaching method capable of easily setting a bonding point. SOLUTION: After an initial value about a lead frame is set (S1), one line of coordinate value about the position of each island of the lead frame is stored in a memory device (S2). Next, a zigzag bonding setting screen with the position of each entered island patterned is displayed on a monitor (S3), and the bonding point is set by inputting a selection state by clicking or the like each patterned position with a mouse. After the bonding point is set to the coordinate value of the island corresponding to the patterned position set to the selection state, and the effect of the bonding to the coordinate value is stored in the memory device (S5), the bonding is conducted. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008098337(A) 申请公布日期 2008.04.24
申请号 JP20060277277 申请日期 2006.10.11
申请人 NIDEC TOSOK CORP;RENESAS TECHNOLOGY CORP 发明人 KAYOIJI HIDEJI;MOROISHI FUMITAKA
分类号 H01L21/52 主分类号 H01L21/52
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