| 摘要 |
PROBLEM TO BE SOLVED: To facilitate expansion of a processing apparatus such as a heat treatment apparatus, improve throughput of the processing for the apparatus itself, also facilitate management of power of respective heat treatment apparatuses, and improve yielding for the processing of the processed substrate. SOLUTION: The substrate processing apparatus includes a plurality of heat treatment apparatus blocks constituted by stacking a plurality of heat treatment apparatuses HP having a substrate to be treated structured to be movable in a heat treatment unit and each including a temperature control mechanism 70 structured to be temperature-controllable for the substrate. It includes a coolant supply mechanism 81 for supplying a coolant set at a predetermined temperature to be supplied to each of the blocks HPB, a supply mechanism 99 in which the coolant supplied from the mechanism 81 is branched and the coolant is supplied to each mechanism 70 of the plurality of heat treatment units HP in one heat treatment apparatus block, and an exhaust mechanism including at least one exhaust port for forming a gas flow from the temperature control mechanism toward the heat treatment unit on the side of the heat treatment unit opposite to the temperature control mechanism. COPYRIGHT: (C)2008,JPO&INPIT
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