发明名称 Low inductance lead frame for a semiconductor package
摘要 A low inductance lead frame (10) is formed to have a die attach area (11). A plurality of intermediate connection bars (12,13,14,15) are positioned to be parallel to sides of the die attach area (11), and to be in a plane that is displaced perpendicularly from the die attach area (11). Each end of each intermediate connection bar is separated from an end of each other intermediate connection bar. Supports (17) extend from the die attach area (11) to the intermediate connection bars (12,13,14,15) to provide support for the intermediate connection bars 12,13,14,15). A plurality of leads (19,33,34) are positional in a plane and have a proximal end near the intermediate connection bars (12,13,14,15).
申请公布号 US5309019(A) 申请公布日期 1994.05.03
申请号 US19930023407 申请日期 1993.02.26
申请人 MOTOROLA, INC. 发明人 MOLINE, DANIEL D.;WEIR, III, BERNARD E.
分类号 H01L23/495;H01L23/64;(IPC1-7):H01L23/48;H01L29/44;H01L29/52;H01L29/60 主分类号 H01L23/495
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