发明名称 Substrate recycling method and recycled substrate
摘要 Exemplary embodiments of the present invention provide a substrate recycling method and a recycled substrate. The method includes separating a substrate having a first surface from an epitaxial layer, performing a first etching of the first surface using electrochemical etching, and performing, after the first etching, a second etching of the first surface using chemical etching, dry etching, or performing, after the first etching, chemical mechanical polishing of the first surface.
申请公布号 US9373496(B2) 申请公布日期 2016.06.21
申请号 US201314085876 申请日期 2013.11.21
申请人 Seoul Viosys Co., Ltd. 发明人 Choi Joo Won;Kim Chang Yeon;Heo Jeong Hoon;Kim Young Wug;Hong Su Yeon;Ryu Sang Wan
分类号 H01L21/302;H01L21/02;H01L29/20;H01L33/00 主分类号 H01L21/302
代理机构 H.C. Park & Associates, PLC 代理人 H.C. Park & Associates, PLC
主权项 1. A substrate recycling method, the method comprising: separating a substrate comprising a first surface from an epitaxial layer; performing a first etching of the first surface using electrochemical etching; and performing, after the first etching, a second etching of the first surface using chemical etching or dry etching, or performing, after the first etching, chemical mechanical polishing of the first surface, wherein: the first surface comprises a sacrificial layer; and the substrate further comprises an etching stop layer disposed under the sacrificial layer.
地址 Ansan-si KR