发明名称 JOINT EXAMINATION DEVICE, JOINING DEVICE, AND JOINT EXAMINATION METHOD
摘要 This joint examination device (11), which examines the joining state of a joined structure obtained by joining a metal member (2, 2') and a resin member (3, 3') at a joining area (BF, BF'), is provided with: a temperature measurement means (14) for measuring the temperature of the metal member (2, 2'); and a determination means (15) which, in cases when the actually measured temperature measured by the temperature measurement means (14) is within a preset reference temperature range in which the joining state between the metal member (2, 2') and the resin member (3, 3') is normal, determines that the joining state is satisfactory.
申请公布号 WO2016140098(A1) 申请公布日期 2016.09.09
申请号 WO2016JP55102 申请日期 2016.02.22
申请人 OMRON CORPORATION 发明人 NISHIKAWA Kazuyoshi
分类号 B23K31/00;B23K26/00;B23K26/08;B23K26/402;B23K26/57;B29C65/16;B29C65/82 主分类号 B23K31/00
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