| 摘要 |
<p>A hermetic module has a frame with an integral heat sink panel (20) extending thereacross between frame walls. High-density integrated circuit electronics (48, 50) are mounted on the heat sink panel (20) by hybrid assembly techniques. Covers (36, 38) are welded to the walls to achieve closure. A feedthrough (74) includes a connector block (84) extending through an opening (82) in a frame front bulkhead (76). The front bulkhead (76) is Kovar clad, and seal is achieved by means of a Kovar flexible seal (92) extending between the Kovar side of the front bulkhead (76) and a Kovar ring (86) on the connector block (84). <IMAGE></p> |
