| 摘要 |
<p>PURPOSE:To provide a semiconductor device in which a wire bonding between a semiconductor chip and leads can be suitably conducted almost without restriction due to an array of leads of a lead frame, an array of pads of the chip and particularly a structure of its lead frame. CONSTITUTION:A semiconductor device connects surface electrodes of a semiconductor chip 5 mounted with a die pad by using a lead frame 1 formed with a die pad 2 and an external lead row 3 having leads 3a-3d to the leads in such a manner that the leads 3b, 3c, 3d extended at a side of the pad 2 are aligned in a stair state by setting a height difference (h) between the inner leads so that bonding wires are not entangled on the way of a loop. Thus, a danger of a wiring trouble in which the loop of the wire is brought into contact with different type lead is reduced.</p> |
