发明名称 Continuous solder system
摘要 A system for the continuous production soldering of circuit boards and other products in which the product is heated by an independently controlled vapor phase system, and solder applied by a separately controlled application system operative to direct one or more controlled and defined streams of solder onto the product. A vessel is provided for containing a heated saturated inert vapor into which the product is introduced prior to solder application. One or more nozzles are disposed within the vessel for directing one or more streams of molten solder to the heated product. The heating and soldering operations are separately controllable and are each substantially independent of the control of the other.
申请公布号 US4685605(A) 申请公布日期 1987.08.11
申请号 US19860872370 申请日期 1986.06.09
申请人 THE HTC CORPORATION 发明人 SPIGARELLI, DONALD J.;PECK, DOUGLAS J.;FINNEY, JAMES L.
分类号 B23K1/015;B23K3/06;(IPC1-7):B23K3/06 主分类号 B23K1/015
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