| 摘要 |
PURPOSE:To inhibit the formation of a thin film on a part other than a substrate and to prevent the sticking of dust to the substrate by placing a heating source for directly heating the substrate in a CVD device so that the interior parts of the device are hardly heated except the substrate. CONSTITUTION:This thin film forming device is provided with a substrate support 17 for supporting a substrate 18 to be treated set in a vessel 11 and a heating source 20 placed in noncontact with the support 17 and in contact with the rear side of the substrate 18. Prescribed gases are fed to the surface of the substrate 18 from gas introducing pipes 15a, 15b and a thin film is deposited by CVD.
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