ELECTRONIC COMPONENT MOUNTING METHOD

摘要

PURPOSE:To improve mounting efficiency of electronic components and mounting quality by measuring the warp amount of a circuit board with a displacement sensor. CONSTITUTION:When target marks at two points on a circuit board 17 are recognized with a camera head 20, the warp amount of the circuit board 17 is measured at a plurality of arbitrary points between the two points by using a displacement sensor 1. The end point of the period in which an XY table 18 can move is set to be a time point when a suction nozzle 13 descends as far as a position where the distance between the tip of the suction nozzle 13 and the upper surface of a circuit board 17 becomes equal to the sum of two times height of an electronic component of the maximum height dimension and the maximum warp amount of the circuit board 17. The beginning point of the period in which the XY table 18 can move is set to be a time point when the suction nozzle 13 ascends as far as the distance between the tip of the suction nozzle 13 and the upper surface of the circuit board 17 becomes equal to the sum of the height of the electronic component of the maximum height dimension and the maximum warp amount of the circuit board. Hence the moving period of the XY table can be set to be long.