发明名称 Method for fabricating a transistor structure
摘要 A method for fabricating a transistor structure with a first and a second bipolar transistor having different collector widths is presented. The method includes providing a semiconductor substrate, introducing a first buried layer of the first bipolar transistor and a second buried layer of the second bipolar transistor into the semiconductor substrate, and producing at least a first collector region having a first collector width on the first buried layer and a second collector region having a second collector width on the second buried layer. A first collector zone having a first thickness is produced on the second buried layer for production of the second collector width. A second collector zone having a second thickness is produced on the first collector zone. At least one insulation region is produced that isolates at least the collector regions from one another.
申请公布号 US8003475(B2) 申请公布日期 2011.08.23
申请号 US20080051928 申请日期 2008.03.20
申请人 INFINEON TECHNOLOGIES AG 发明人 BOECK JOSEF;LACHNER RUDOLF;MEISTER THOMAS;STENGL REINHARD;SCHAEFER HERBERT;SECK MARTIN
分类号 H01L21/331;H01L21/8222;H01L27/082;H01L29/08 主分类号 H01L21/331
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