| 摘要 |
PROBLEM TO BE SOLVED: To effectively remove voids concentrating in the vicinity of a gate opening part even if a second air vent is formed on the side of the gate opening surface of a cavity. SOLUTION: A resin mold apparatus is constituted so that a runner 9 for guiding a liquid resin 6, a cavity 7 housing a resin molding member such as a lead frame or the like, the gate 11 allowing the runner 9 and a cavity 10 to communicate with each other and the air vent 12 opened to the inner wall opposed to the gate opening surface of the cavity 10 and allowing the air compressed by the resin flowing in the cavity 10 housing the resin molding member to be mated with the member from the gate 11 are formed to the mating surfaces of a pair of upper and lower molds 7, (8). In this case, a resin sump 17 is formed on the mating surfaces of the molds 7, (8) at the position close to the gate 11 and the cavity 10 and a second air vent 16 is formed by allowing the resin sump 17 to communicate with the surface having the gate 11 opened thereto of the cavity 10. |
