| 摘要 |
PROBLEM TO BE SOLVED: To provide a grinding wheel that permits excellent polishing rate and surface roughness in the polishing of glass substrate such as glass substrate for magnetic disk and the like. SOLUTION: This grinding wheel is provided with wheel grains and resin that can combine these grains (phenole resin to be used for common resinoid grinding wheel). The compression elasticity rate is 100-4000 Mpa and the tensile strain is 0.1-1.0%. At this time, it is favorable that the wheel grain rate is 25-50% in volume. As wheel grains, cerium oxide with average grain size of 0.1-5.0μm and purity 35-95% in weight, and zirconium with average grain size of 0.1-5.0μm are suitable. The use of this grinding wheel enables the polishing of well flat plane without causing scratch with the same polishing rate as slurry and the reduction of polishing cost.
|
