发明名称 Method of packaging a semiconductor light emitting die
摘要 A semiconductor light emitting device is packaged by forming a sealed compartment enclosing the device, at least one of the walls of the sealed compartment being formed of an elastomeric material. The elastomeric material is then penetrated with a needle and a quantity of softer material is injected through the needle into the sealed compartment. In some embodiments, a coaxial needle or two needles are used, one needle to inject the softer material and one needle to vent air from the compartment.
申请公布号 EP1544925(A2) 申请公布日期 2005.06.22
申请号 EP20040106419 申请日期 2004.12.09
申请人 PHILIPS LUMILEDS LIGHTING COMPANY LLC 发明人 COLLINS, WILLIAM, D.
分类号 H01L33/52;(IPC1-7):H01L33/00 主分类号 H01L33/52
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