| 发明名称 |
METHOD AND APPARATUS FOR ATTACHING A DIE TO A SUBSTRATE |
| 摘要 |
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die. ® KIPO & WIPO 2007 |
| 申请公布号 |
KR20070028571(A) |
申请公布日期 |
2007.03.12 |
| 申请号 |
KR20077001534 |
申请日期 |
2007.01.22 |
| 申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
DCAMP JON B.;GLEN MAX C.;DUNAWAY LORI A.;CURTIS HARLAN L. |
| 分类号 |
H01L21/58;B81B7/00;G01C19/5719;H01L21/60;H01L21/603 |
主分类号 |
H01L21/58 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
